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Effects of Multiple Reworks on the Accelerated Thermal Cycling and Shock Performance of Lead-Free BGA Assemblies
Hongtao Ma,, Weidong Xie,, Subbarayan, G.Volume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2207722
Date:
November, 2012
File:
PDF, 3.53 MB
english, 2012