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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Effect of orientation on the convective boiling performance of microchannel heat sink using HFE-7100
Kai-Shing Yang,, Yeau-Ren Jeng,, Chun-Min Huang,, Chi-Chuan Wang,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382191
File:
PDF, 1.53 MB
english, 2009