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[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Evaluation of thermal shear strains in flip-chip package by electronic speckle pattern interferometry (ESPI)
Woosoon Jang,, Baik-Woo Lee,, Dong-Won Kim,, Jae-Woong Nah,, Kyung-Wook Paik,, Dongil Kwon,Year:
2001
Language:
english
DOI:
10.1109/EMAP.2001.984002
File:
PDF, 507 KB
english, 2001