In Situ Stress and Reliability Monitoring on Plastic Packaging Through Piezoresistive Stress Sensor
Yu-Yao Chang,, Hsien Chung,, Ben-Je Lwo,, Kun-Fu Tseng,Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2253158
Date:
August, 2013
File:
PDF, 1.10 MB
english, 2013