[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Reliability assessments and designs for fine pitch flip chip packages with Cu column bumps
Hsieh, Ming-Che, Chien Chen Lee,, Li Chiun Hung,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420243
File:
PDF, 2.07 MB
english, 2012