[IEEE Proceedings of the IEEE 2006 International...

  • Main
  • [IEEE Proceedings of the IEEE 2006...

[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - UV/EB Cure Mechanism for Porous PECVD/SOD Low-k SiCOH Materials

Nakao, S.-I., Ushio, J., Ohno, T., Hamada, T., Kamigaki, Y., Kato, M., Yoneda, K., Kondo, S., Kobayashi, N.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2006
Language:
english
DOI:
10.1109/IITC.2006.1648648
File:
PDF, 954 KB
english, 2006
Conversion to is in progress
Conversion to is failed