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[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - UV/EB Cure Mechanism for Porous PECVD/SOD Low-k SiCOH Materials
Nakao, S.-I., Ushio, J., Ohno, T., Hamada, T., Kamigaki, Y., Kato, M., Yoneda, K., Kondo, S., Kobayashi, N.Year:
2006
Language:
english
DOI:
10.1109/IITC.2006.1648648
File:
PDF, 954 KB
english, 2006