[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermo-mechanical simulation of BCB membrane thin-film package
Seok, S., Kim, Janggil, Rolland, N., Rolland, P. A., Bouwstra, SiebeYear:
2010
Language:
english
DOI:
10.1109/esime.2010.5464577
File:
PDF, 7.06 MB
english, 2010