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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - High density fine pitch Pb-free flip-chip interconnect assembly
Lim, S.P.-S., Chua Khoon Lam,, Lee, C., Poi-Siong Teo,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271492
File:
PDF, 382 KB
english, 2003