The Role of Aging on Dynamic Failure Envelopes of OSP-Sn37Pb Interconnects in Plastic Ball Grid Array (PBGA) Packages
Varghese, J., Dasgupta, A., Song, B., Azarian, M., Pecht, M.Том:
32
Мова:
english
Журнал:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2009.2013985
Date:
March, 2009
Файл:
PDF, 736 KB
english, 2009