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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Studies on electrical performance and thermal stress of a silicon interposer with TSVs
Sunohara, Masahiro, Sakaguchi, Hideaki, Takano, Akihito, Arai, Rie, Murayama, Kei, Higashi, MitsutoshiYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490837
File:
PDF, 2.57 MB
english, 2010