[IEEE 2008 International Conference on Signals and Electronic Systems - Krakow, Poland (2008.09.14-2008.09.17)] 2008 International Conference on Signals and Electronic Systems - 3D electromagnetic chip package simulation for high-speed serial interface application
Rydygier, Adam, Kakerow, Ralf, Munteanu, Irina, Buchmann, Michael, Muller, MarkusYear:
2008
Language:
english
DOI:
10.1109/icses.2008.4673358
File:
PDF, 352 KB
english, 2008