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[IEEE 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003. - High Tatras, Slovakia (2003.05.11-2003.05.11)] 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003. - Influence of the Cu substrate surface energy on lead-free solder paste wetting properties
Sitek, J., Bukat, K., Borecki, J., Ionescu, C.Year:
2003
Language:
english
DOI:
10.1109/isse.2003.1260524
File:
PDF, 405 KB
english, 2003