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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Bump shape control on high speed copper pillar plating process in lead-free wafer level packaging
Stream Chung,, Emile Kuo,, Maggie Tseng,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382210
File:
PDF, 1.60 MB
english, 2009