[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Process and materials considerations for Pb-free flip chip packaging of 65nm Cu/low-k device
Min, Tan, Kheng, Soh, Lim, Sharon, Lee, CharlesYear:
2006
Language:
english
DOI:
10.1109/eptc.2006.342739
File:
PDF, 671 KB
english, 2006