[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - First-principles based modeling for influence of epitaxy and packaging induced strains on emission properties of III-nitrides LED chips
Yan, Han, Gan, Zhiyin, Song, Xiaohui, Chen, Zhaohui, Xu, Jingping, Liu, ShengYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270718
File:
PDF, 929 KB
english, 2009