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[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - CMOS stress sensor for 3D integrated circuits: Thermo-mechanical effects of Through Silicon Via (TSV) on surrounding silicon
Ewuame, Komi Atchou, Fiori, Vincent, Inal, Karim, Bouchard, Pierre-Olivier, Gallois-Garreignot, Sebastien, Lionti, Sylvain, Tavernier, Clement, Jaouen, HerveYear:
2014
Language:
english
DOI:
10.1109/eurosime.2014.6813808
File:
PDF, 1.64 MB
english, 2014