[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Fan-Out Wafer-Level Packaging with highly flexible design capabilities
Kurita, Yoichiro, Kimura, Takehiro, Shibuya, Koujirou, Kobayashi, Hiroaki, Kawashiro, Fumiyoshi, Motohashi, Norikazu, Kawano, MasayaYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642888
File:
PDF, 2.62 MB
english, 2010