[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results
Weidmann, Diane, Dubois, Guillaume, Hertl, Michael, Chauffleur, XavierYear:
2011
Language:
english
DOI:
10.1109/esime.2011.5765836
File:
PDF, 1.89 MB
english, 2011