[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Chip-on-board (COB) wafer level packaging of LEDs using silicon substrates and chemical foaming process(CFP)-made glass-bubble caps
Yu, Hui, Shang, Jintang, Xu, Chao, Luo, Xinhu, Liu, Jingdong, Zhang, Li, Lai, ChimingYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066806
File:
PDF, 2.22 MB
english, 2011