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[IEEE 2003 IEEE Conference on Electron Devices and Solid-State Circuits - Hong Kong, China (16-18 Dec. 2003)] 2003 IEEE Conference on Electron Devices and Solid-State Circuits (IEEE Cat. No.03TH8668) - Fabricating copper interconnects by displacement technology for ULSI
Chin-Hao Yang,, Don-Gey Liu,, Tsong-Jen Yang,, Wen-Luh Yang,, Giin-Shan Chen,Year:
2003
Language:
english
DOI:
10.1109/edssc.2003.1283562
File:
PDF, 269 KB
english, 2003