[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)
Hsiang-Chen Hsu,, Shen-Wen Ju,, Jie-Rong Lu,, Shen-Li Fu,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382299
File:
PDF, 1.78 MB
english, 2009