![](/img/cover-not-exists.png)
[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Assembly and interconnection technologies for MID based on thermally conductive plastics for heat dissipation
Hoerber, Johannes, Mueller, Martin, Franke, Joerg, Ranft, Florian, Heinle, Christoph, Drummer, DietmarYear:
2011
Language:
english
DOI:
10.1109/isse.2011.6053559
File:
PDF, 990 KB
english, 2011