![](/img/cover-not-exists.png)
[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Extra thin profile land grid array package solder joint reliability assessment
Wong, Pak, Ying, Ming, Tengh, Alfred, Mohtar, Arman, Chia, YewYear:
2006
Language:
english
DOI:
10.1109/eptc.2006.342734
File:
PDF, 600 KB
english, 2006