[IEEE International Electron Devices Meeting. Technical Digest - San Francisco, CA, USA (8-11 Dec. 1996)] International Electron Devices Meeting. Technical Digest - Barrier metal free copper damascene interconnection technology using atmospheric copper reflow and nitrogen doping in SiOF film
Mikagi, K., Ishikawa, H., Usami, T., Suzuki, M., Inoue, K., Oda, N., Chikaki, S., Sakai, I., Kikkawa, T.Year:
1996
Language:
english
DOI:
10.1109/iedm.1996.553604
File:
PDF, 444 KB
english, 1996