Experimental validation of crosstalk simulations for...

IEEE Transactions on Advanced Packaging 2005 / 02 Vol. 28; Iss. 1

Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters

Kobrinsky, M.J., Chakravarty, S., Jiao, D., Harmes, M.C., List, S., Mazumder, M.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2004.841672
Date:
February, 2005
File:
PDF, 774 KB
english, 2005
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