![](/img/cover-not-exists.png)
[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Analytical extraction of via-via inductance by using SMM for power-ground planes
Guang-Xiao Luo,, Xing-Chang Wei,, Xiang Cui,, Er-Ping Li,Year:
2011
DOI:
10.1109/edaps.2011.6213810
File:
PDF, 182 KB
2011