[IEEE 2011 IEEE Electrical Design of Advanced Packaging and...

  • Main
  • [IEEE 2011 IEEE Electrical Design of...

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Analytical extraction of via-via inductance by using SMM for power-ground planes

Guang-Xiao Luo,, Xing-Chang Wei,, Xiang Cui,, Er-Ping Li,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2011
DOI:
10.1109/edaps.2011.6213810
File:
PDF, 182 KB
2011
Conversion to is in progress
Conversion to is failed