Predictive Model Development for Life Prediction of PBGA...

IEEE Transactions on Components and Packaging Technologies 2010 / 03 Vol. 33; Iss. 1

Predictive Model Development for Life Prediction of PBGA Packages With SnAgCu Solder Joints

Tunga, K., Sitaraman, S.K.
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Volume:
33
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2009.2032924
Date:
March, 2010
File:
PDF, 1.88 MB
english, 2010
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