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[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Modeling of corrugated diaphragms for condenser microphones
Chang-Hung Chen,, Heng-Chuan Kan,, Po-Hua Yang,, Wang Yeng-Tseng,Year:
2007
Language:
english
DOI:
10.1109/impact.2007.4433591
File:
PDF, 958 KB
english, 2007