[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - Effects of assembly methodology on manufacturing-induced stresses in μBGA packages
Pei-Haw Tsao,, Chun-Liang Chen,, Yu-Jen Huang,, Chender Huang,Year:
1999
Language:
english
DOI:
10.1109/ectc.1999.776248
File:
PDF, 336 KB
english, 1999