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Effect of Capillary Trace on Dynamic Loop Profile Evolution in Thermosonic Wire Bonding
Wang, Fuliang, Chen, Yun, Han, LeiVolume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2206593
Date:
September, 2012
File:
PDF, 1.98 MB
english, 2012