Ultrasonic Bonding of Electrodes of Rigid and Flexible...

The Journal of Adhesion 2009 / 05 Vol. 85; Iss. 6

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

Lee, Jong-Bum, Koo, Ja-Myeong, Kim, Jong-Woong, Noh, Bo-In, Lee, Jong-Gun, Jung, Seung-Boo
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Volume:
85
Language:
english
Journal:
The Journal of Adhesion
DOI:
10.1080/00218460902880198
Date:
May, 2009
File:
PDF, 730 KB
english, 2009
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