Fundraising September 15, 2024 – October 1, 2024 About fundraising

[IEEE High Density Packaging (ICEPT-HDP 2011) - Shanghai...

  • Main
  • [IEEE High Density Packaging (ICEPT-HDP...

[IEEE High Density Packaging (ICEPT-HDP 2011) - Shanghai (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Carrier frequency offset estimation for PUCCH in high speed train environment

Ren, Xiaona, Ren, Guangliang, Le, Chunhui
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2011
Language:
english
DOI:
10.1109/icept.2011.6112339
File:
PDF, 213 KB
english, 2011
Conversion to is in progress
Conversion to is failed