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[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Wafer level CSP using low cost electroless redistribution layer
Teutsch, T., Oppert, T., Zakel, E., Klusmann, E., Meyer, H., Schulz, R., Schulze, J.Year:
2000
Language:
english
DOI:
10.1109/ectc.2000.853128
File:
PDF, 707 KB
english, 2000