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Ultrawide Bandwidth Chip-to-Chip Interconnects for III-V MMICs
Fay, Patrick, Kopp, David, Lu, Tian, Neal, David, Bernstein, Gary H., Kulick, Jason M.Volume:
24
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/lmwc.2013.2288181
Date:
January, 2014
File:
PDF, 350 KB
english, 2014