[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The design and fabrication of RF band pass filter by LTCC technology
Yuanxun Li,, Yingli Liu,, Huaiwu Zhang,, Dafu Lu,, Lifei Bian,, Zongbao Yang,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607080
File:
PDF, 560 KB
english, 2008