[IEEE 52nd Electronic Components and Technology Conference...

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[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Application of no-flow underfill for a reliable high performance Flip Chip Flex BGA

Poi-Siong Teo,, Lim, S.P.-S., Tai-Chong Chai,, Iyer, M.K.
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Year:
2002
Language:
english
DOI:
10.1109/ectc.2002.1008131
File:
PDF, 770 KB
english, 2002
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