Characterization of the Chemical-Mechanical Polishing...

Characterization of the Chemical-Mechanical Polishing Process Based on Nanoindentation Measurement of Dielectric Films

Liu, Chi-Wen
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Volume:
142
Year:
1995
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2048695
File:
PDF, 865 KB
english, 1995
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