Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging
Xiang Dai,, Brillhart, M.V., Roesch, M., Ho, P.S.Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.833050
Date:
March, 2000
File:
PDF, 960 KB
english, 2000