[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Lithography challenges for 2.5D interposer manufacturing
Cochet, Klaus Ruhmer Philippe, McCleary, Roger, Rogoff, Rich, Roy, RajivYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897334
File:
PDF, 914 KB
english, 2014