[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Electrothermal coupling analysis of current crowding and Joule heating in flip-chip package assembly
Chin-Li Kao,, Yi-Shao Lai,Year:
2004
Language:
english
DOI:
10.1109/eptc.2004.1396614
File:
PDF, 397 KB
english, 2004