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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Snap Cure Wafer Back Glue Coating as Die Attach Method for Transistor and Diode Dice
Lui, Ben H.W., van Rijckevorsel, Hans, Tsang, Paul P.H., Tsang, Mable M.P., Leung, Max C.H., Bok, Aernout Reints, Mohamed, Lebbai, Chan, C.Y., Dirkzwager, MaartenYear:
2006
Language:
english
DOI:
10.1109/EMAP.2006.4430611
File:
PDF, 1.86 MB
english, 2006