MICRO: a new hybrid test data compression/decompression scheme
Sunghoon Chun,, YongJoon Kim,, Jung-Been Im,, Sungho Kang,Volume:
14
Language:
english
Journal:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
DOI:
10.1109/tvlsi.2006.878227
Date:
June, 2006
File:
PDF, 575 KB
english, 2006