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[IEEE 2014 IEEE 5th Latin American Symposium on Circuits and Systems (LASCAS) - Santiago, Chile (2014.02.25-2014.02.28)] 2014 IEEE 5th Latin American Symposium on Circuits and Systems - Simulation in 3D integration and TSV

Weide-Zaage, K., Moujbani, A., Kludt, J.
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Year:
2014
Language:
english
DOI:
10.1109/lascas.2014.6820324
File:
PDF, 325 KB
english, 2014
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