High-frequency SPICE model of anisotropic conductive film...

IEEE Transactions on Components and Packaging Technologies 2000 / Sept. Vol. 23; Iss. 3

High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Woonghwan Ryu,, Myung-Jin Yim,, Seungyoung Ahn,, Junho Lee,, Woopoung Kim,, Kyung-Wook Paik,, Joungho Kim,
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Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.868855
Date:
January, 2000
File:
PDF, 169 KB
english, 2000
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