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[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Design, fabrication, and property measurement of a zero-insertion-force (ZIF) MEMS connector
Ben-Hwa Jang,, Hsin-Yu Huang,, Weileun Fang,, Shin-Way Lin,Year:
2008
Language:
english
DOI:
10.1109/emap.2008.4784247
File:
PDF, 4.68 MB
english, 2008