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[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - A numerical model for transport in heat pipes considering wick microstructure effects
Ranjan, Ram, Murthy, Jayathi Y., Garimella, Suresh V., Vadakkan, UnnikrishnanYear:
2010
Language:
english
DOI:
10.1109/itherm.2010.5501374
File:
PDF, 798 KB
english, 2010