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[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Flip-chip interconnects based on solution deposited carbon nanotube bumps
Xu, Pingye, Hamilton, Michael C.Year:
2014
Language:
english
DOI:
10.1109/iitc.2014.6831849
File:
PDF, 2.63 MB
english, 2014