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Prediction of stress-strain relationship with an improved Anand constitutive Model For lead-free solder Sn-3.5Ag
Xu Chen,, Gang Chen,, Sakane, M.Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2004.843157
Date:
March, 2005
File:
PDF, 362 KB
english, 2005