Thermal and mechanical stability of soldering QFP with...

IEEE Transactions on Electronics Packaging Manufacturing 2002 / 10 Vol. 25; Iss. 4

Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy

Suganuma, K., Sakai, T., Keun-Soo Kim,, Takagi, Y., Sugimoto, J., Ueshima, M.
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2002.807718
Date:
October, 2002
File:
PDF, 780 KB
english, 2002
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