[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Transmission electron microscopy investigations on the growth of tin whiskers from CeSn3 substrate
Li, Cai-Fu, Liu, Zhi-Quan, Shang, Jian-KuYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066976
File:
PDF, 618 KB
english, 2011